IC
C8300 KMP series photoresist is a I line photoresist with high heat resistance and high etch resistance. It adopts a unique resin structure and a formula system. It can keep the same shape when baking at 140 degrees centigrade. The series of photoresist have different viscosity. The range of film thickness for 1.0-4.0um and resolution of 0.6um. Also has photographic speed, high resolution and process window and other advantages, suitable for integrated circuit manufacturing process of implant, metal layers. has been widely commercial in the domestic main integrated circuit manufacturing enterprises.

Product Data>

友情链接:新狗万网站  澳门皇冠体育网址  亚博电竞竞猜  利来资源站  玛雅娱乐app  大发娛乐城  ag环亚国际旗舰厅  开元棋牌app