C8300 KMP series photoresist is a I line photoresist with high heat resistance and high etch resistance. It adopts a unique resin structure and a formula system. It can keep the same shape when baking at 140 degrees centigrade. The series of photoresist have different viscosity. The range of film thickness for 1.0-4.0um and resolution of 0.6um. Also has photographic speed, high resolution and process window and other advantages, suitable for integrated circuit manufacturing process of implant, metal layers. has been widely commercial in the domestic main integrated circuit manufacturing enterprises.

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