KMP C6111 series photoresist are I-line positive photoresist with film thickness around 5um. It was designed for metal PAD layer and DNW implant layer. This series of photoresist have faster photospeed, good thermal stability, and large process window, suitable for integrated circuit manufacturing process. It also shows good ETCH and implant resistance and can be removed by common remover, have been widely used in the domestic main integrated circuit manufacturing enterprises.

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